Maant Cjy-01 250ml Bga Gel Remover
- Specialized BGA underfill remover for chip-level motherboard repair
- Effectively dissolves BGA gel and adhesives without damaging components
- Ideal for IC chip reballing, replacement, and rework
- Clean formula leaves no sticky residues, ensuring better soldering results
- 250ml bottle – compact, easy to store and use in repair stations
- Safe on PCBs and components, minimizing risk during delicate procedures
- Suitable for use with hot air or infrared BGA stations
The Maant CJY-01 250ml BGA Gel Remover is a professional-grade solvent designed specifically for removing underfill gel and residues from BGA (Ball Grid Array) chips during motherboard and IC repair. It offers fast and safe cleaning, ideal for preparing chips for reballing, reflow, or replacement.
| Feature | Details |
|---|---|
| Brand | Maant |
| Product Name | CJY-01 250ml BGA Gel Remover |
| Size / Type | 250ml Gel Remover Solution |
| Color | Transparent or Light Yellow (depending on formulation) |
| Type | BGA (Ball Grid Array) underfill and gel remover |
| Suitable For | Motherboard repair, BGA chip rework, IC cleaning, soldering prep |
| Material | Specially formulated solvent for dissolving and removing BGA underfill gel |
| Handle Design | N/A (Liquid product, comes in a bottle) |
| Durability | Powerful and efficient gel removal while protecting delicate PCB components |
| Usage | Ideal for cleaning BGA chips, underfill gel removal, and prep for reballing |
| Portability | Compact and lightweight, easy to store in technician toolkits |
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Maant Cjy-01 250ml Bga Gel Remover
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