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Sunshine RMA-228 premium BGA IC flux paste for micro-soldering and rework
RMA (Rosin Mildly Activated) formula for excellent solder wetting and adhesion
No-clean, non-corrosive, transparent, and lead-free compatible
Ideal for BGA reballing, IC repair, PCB soldering, and electronics maintenance
Supplied in 10 cc syringe for precise application

Sunshine RMA -228 Bga Ic Flux Paste

Imported lead-free materials, perfect formula, high quality.
Make of the newest rosin and other imported high-quality materials.
Embellish tin fast, low smoke, less residue and surface with low insulation resistance.
Widely used in mobile phones, computers, graphics cards, projectors and electronic products.For welding and rework BGA, CSP and BGA chip, especially for high-class mobile phones, have a good run of tin and Solder ability.

Weight	0.05 kg
Dimensions	82079010 cm

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